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Magazine/PCB
Magazine/PCB
❖ Features
- Simultaneous cleaning of MZ Slot and PCB surface at the post-marking stage during the semiconductor assembly PKG process.
(Clean by inserting PCB or CARRIER into magazine)
- Improved ultrasonic efficiency by using uniform bubble nuclei generated by WRS.
- FINAL RINSE by steam.
- Completely dried by vacuum drying. (Prevention of secondary pollution)
| Guarantee |
|---|
| 100 NANO |
| 1.0 ㎛ |
