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PCB(Class 10)
PCB(Class 10)
❖ Features
- Clean the contaminated DIE surface after cutting the WAFER. (Load DIE on dedicated tray)
- Ultrasonic cleaning process by WRS
- Ultrasonic RINSE and FINAL steam RINSE.
- Completely dried by vacuum drying. (Prevention of secondary pollution)
| Guarantee |
|---|
| 100 NANO |
| 1.0 ㎛ |
